Epoxy Resin Wood Table Silicone Mold for Epoxy Resin Dining Table

• CAS No.: 61788-97-4
• Formula: (C11h12o3)N
• EINECS: N/a
• Bonding Function: High Temperature Resistant Adhesive
• Morphology: Solvent
• Application: Woodworking
• Model NO.: JQ31-9T
• Material: Epoxy
• Classification: Double Components Adhesives
• Main Agent Composition: Thermosetting Resin
• Characteristic: Waterproof
• Promoter Composition: Curing Agent
• Composition: Organic Material
• Color: Transparent
• Other Names: Epoxy Resin for Table
• Usage: Construction, Woodworking, Tabletop
• Keywords: Epoxy Resin Ab
• Shelf Life: 12 Months
• Feature: Non Voc,Non Odour,100% Solid, Solvent Free
• MOQ: 15kgs
• Main Raw Material: Epoxy
• Type: Epoxy Resin Ab
• Packing: a 5kg/Barrel*2+ B 5kg/Barrel
• Advantage: Thick Pour,Easy for Operation,Less Bubble
• Product Name: Deep Pour Resin
• Einecs No.: N/a
• Mf: (C11h12o3)N
• Mixing Ratio: a:B=2:1
• Certificate: MSDS
• Transport Package: Plastic Drum + Carton
• Specification: 5kg/barrel
• Trademark: JQ
• Origin: China
• HS Code: 3506912000
• Production Capacity: 5000000tons

Product Description

Epoxy Resin Wood Table Silicone Mold For Epoxy Resin Dining Table

Product Description

Properties before Hardening

Part	JQ31-7TA	JQ31-7TB
Color	Transparent	Transparent
Specific gravity	1.15	0.96
Viscosity (25ºC)	2000-4000CPS	80 MAXCPS
Mixing ratio	A: B = 100:33(weight ratio)	A: B = 100:33(weight ratio)
Hardening conditions	25 ºC×8H to 10H or 55ºC×1.5H (2 g)	25 ºC×8H to 10H or 55ºC×1.5H (2 g)
Usable time	25ºC×40min (100g)	25ºC×40min (100g)

Application

JQ31-7T specially designed for large size wood table casting, lamp potting and mold filling, etc.. 

Feature

Epoxy resin JQ31-7T can be cured under normal temperature and high temperature, with the feature of good flowing property, low viscosity, very little heat release, natural defoaming, anti-yellow, high transparency, no ripple, bright in surface. 

 Operation

1.Weigh A and B glue according to the given weight ratio into the prepared cleaned container, fully mixed the mixture again the container wall by clockwise, place it along for 3 to 5 minutes, and then it can be used.

2.Take the glue according to the usable time and dosage of mixture to avoid wasting. When the temperature is below 15 ºC, please heat A glue to 30 ºC first and then mix it to the B glue (A glue will be thicken in low temperature ); The glue must be sealed lid after use to avoid rejection caused by moisture absorption.

3.When the relative humidity is higher than 85%, the surface of the cured mixture will absorb moisture in the air, and form a layer of white mist in the surface, so when the relative humidity is higher than 85%, is not suitable for room temperature curing, suggest to use the heat curing.

Packaging & Shipping

Packaging	Regular packing, Protect by Pallet
Delivery Port	Tianjin
Delivery Time	7-15 working days

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